Winlex ® And Fintac ® Product table
Project
Basic resin
Softening point ℃
Color number
Acid value mgKOH/g
Application
4000-7600
8 Max
50-70
Widely used in hot melt adhesives, solvent adhesives, and water-based adhesives to increase the initial adhesion and peeling force.
100-2500mpas
8 Max
30Max
Widely used in hot melt adhesives, solvent adhesives, and water-based adhesives to increase the initial adhesion and peeling force.
20000-50000mpas
10 Max
5-12
Widely used in hot melt adhesives, solvent adhesives, and water-based adhesives to increase the initial adhesion and peeling force.
4500-25000mpas
8 Max
9-16
Widely used in hot melt adhesives, solvent adhesives, and water-based adhesives to increase the initial adhesion and peeling force.
25000-45000mpas
5 Max
10 Max
Widely used in hot melt adhesives, solvent adhesives, and water-based adhesives to increase the initial adhesion and peeling force.
12000-18000mpas
6 Max
20 Max
Widely used in hot melt adhesives, solvent adhesives, and water-based adhesives to increase the initial adhesion and peeling force.
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